«Lux-X» invites everyone to visit their stand at the International Forum of Food Industry and Packaging IFFIP 2018

06.04.2018

Dear partners, colleagues and friends! We invite you to visit the «Lux-X» stand at the International Forum of Food Industry and Packaging IFFIP. The forum will be held on April 18-20 2018 in the International Exhibition Center (IEC), Kiev, Ukraine.

The International Forum of Food Industry and Packaging includes four exhibitions: Pack Expo, Prod Expo, ProdTechMach and Bakery and Confectionery Industry.

The international exhibition Pack Expo, where the Lux-X stand will be located, is an exhibition of packaging as well as packaging and printing equipment, technologies and materials.

At the exhibition in 2018, «Lux-X» will present not only a traditional range of packaging, labeling and printing adhesives, but also its novelties: hydrophobic coatings for corrugated cardboard and glue to bond cardboard boxes with products in stacks on pallets. This adhesive binding technology will save on materials for palletizing, which is important for Ukrainian manufacturers focused on optimizing costs.

During the exhibition, from 10 am to 6 pm, technical experts and managers will be present at our stand and you will be able to discuss in informal surroundings how to select adhesives for your enterprise and how to start and develop cooperation with Lux-X. 

The exhibition will be held on April 18-20 in the International Exhibition Center (IEC), in Kiev, 15 Brovars`kyi Ave., Kiev, Ukraine. The Lux-X Research and Production Enterprise, Ltd,Stand, will be located in the pavilion # 3, stand # 3A 323.

An invitation ticket to the exhibition can be obtained by registering using this link: www.invitation.kiev.ua

We are waiting for you at the Lux-X Research and Production Enterprise stand!

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