«Lux-X» invites everyone to visit the stand at the International Forum of Food Industry and Packaging IFFIP 2018
Dear partners, colleagues and friends! We invite you to visit the «Lux-X» stand at the International Forum of Food Industry and Packaging IFFIP. The forum will be held on April 18-20 2018 in the International Exhibition Center (IEC), Kiev, Ukraine.
The International Forum of Food Industry and Packaging includes four exhibitions: Pack Expo, Prod Expo, ProdTechMach and Bakery and Confectionery Industry.
The international exhibition Pack Expo, where the Lux-X stand will be placed is an exhibition of packaging, packaging and printing equipment, technologies and materials.
At the exhibition in 2018, «Lux-X» will present not only a traditional range of packaging, labeling and printing adhesives, but also its novelties: hydrophobic coatings for corrugated cardboard and glue to bond cardboard boxes with products in stacks on pallets. The technology with adhesive binding will save on materials for palletizing, which is relevant for Ukrainian manufacturers focused on optimizing costs.
During the exhibition, from 10 am to 6 pm, technical experts and managers will be present at our stand and you will be able to discuss in informal surroundings how to select adhesives for your enterprise, how to start and develop cooperation.
The exhibition will be held on April 18-20 in the International Exhibition Center (IEC), in Kiev, 15 Brovars`kyi Ave., Kiev, Ukraine. The Stand of Lux-X Research and Production Enterprise, Ltd, will be located in the pavilion # 3, stand # 3A 323.
An invitation ticket to the exhibition can be obtained by registering under the link: www.invitation.kiev.ua
We are waiting for you at the stand of Lux-X Research and Production Enterprise!